low pressure plasma processes can be broken down into 3 main groups
1. Cleaning
The removal of contamination either organic or inorganic from the surface.
2. Etching
A process to actively remove material from the surface of the substrate.
3. Coating
The functionality or the look of the surface is modified to fit customer needs.
Efficiency
The low-pressure plasma processor can be programed to carry out a single or a combination of these plasma processes without the need to handle the product until completed.
An example application of multiple process steps is optimizing bond strength or the adhesion of paints. For more information, please see our page on improved adhesion.